MIL-C-60898/11(MU)
REQUIREMENTS
3.
Fabrication.
The assembly shall be manufactured in accord-
3.1
ance with Drawing
F10554194 and drawings pertaining thereto.
The assembly shall meet the require-
3.2' General specification.
ments of MIL-C-60898.
See MIL-C-60898.
3.3
Environmental
service
conditions.
Performance at temperature extremes.
For the conditions
3.3.1
of 3.3.2 of MIL-C-60898, the requirements of 3.4 shall be met
with exceptions as specified in the following subparagraphs.
As specified in 3.4.1,4
Diodes, reverse current.
3.3.1.1
except the current shall be no greater than 0.1 ma between
the pins specified.
As specified in 3.4.1.5 except
3.3.1.2 Diodes, forward drop.
0.5 vdc between the pins specified.
the voltage drop shall be 1.0
As specified in 3.4.2 except the capacitance
3.3.1.3
Capacitance.
15 percent.
between pin 27 and pin 1 shall be 0.1
As specified in 3.4.3 except the resistance
3.3.1.4
Resistance.
3 percent and
10 percent for the values specified.
shall be
3.4
Electrical
performance
Diode
network
3.4.1
With the input circuitry connected to
Pin 6 output.
3.4.1.1
pin 6 as shown in Figure 1, the voltage at pin 6 shall be less
than +3.55 vdc but greater than +3.00 vdc.
With the input circuitry connected to
3.4.1.2 Pin 12 output.
pin 12, as shown in Figure 1, the out put voltage at pin 12 shall
be less than +3.55 vdc but greater than +3.00 vdc.
With the input circuitry connected to
3.4.1.3 Pin 9 output.
pin 6 or pin 12, as shown in Figure 2, the output voltage at
pin 9 shall be less than +5.85 vdc but greater than +5.40 vdc.
With the input circuitry connected to pin 6 or pin 12, as shown
in Figure 2 but with reversed polarity, the output voltage at
0.1 vdc.
pin 9 shall be - 10
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